Heat-conducting silica gel sheet adhesive
Main properties: insulation, heat conduction, compression resistance, self-adhesion, etc.
Scope of application: transistors for general electronic products, as well as RDRAMTM, CD-ROM, CPU, pipeline transportation equipment, and any articles requiring filling and heat dissipation;
Product size: usually 200*400mm sheets can be cut into various types of soft silicon films according to different requirements of customers (positive and negative tolerances depend on different situations, such as thickness tolerance will vary, basically within+/-±0.5mm), single-sided and double-sided adhesive can be used to increase its bonding strength.
Note: The color, thickness, hardness and thermal conductivity of this product can be adjusted according to the specific requirements of customers. The above text is for reference only.